Stress and Strain Engineering at Nanoscale in Semiconductor Devices 1st Edition by Chinmay K. Maiti 0367519291 9780367519292

Stress and Strain Engineering at Nanoscale in Semiconductor Devices 1st Edition Chinmay K. Maiti – Ebook Instant Download/Delivery ISBN(s): 9780367519292,0367519291

Product details:

• ISBN 10: 0367519291
• ISBN 13: 9780367519292
• Author: Chinmay K. Maiti

Anticipating a limit to the continuous miniaturization (More-Moore), intense research efforts are being made to co-integrate various functionalities (More-than-Moore) in a single chip. Currently, strain engineering is the main technique used to enhance the performance of advanced semiconductor devices. Written from an engineering applications standpoint, this book encompasses broad areas of semiconductor devices involving the design, simulation, and analysis of Si, heterostructure silicongermanium (SiGe), and III-N compound semiconductor devices. The book provides the background and physical insight needed to understand the new and future developments in the technology CAD (TCAD) design at the nanoscale.

Table contents:

Chapter 1: Introduction
Chapter 2: Simulation Environment
Chapter 3: Stress Generation Techniques in CMOS Technology
Chapter 4: Electronic Properties of Engineered Substrates
Chapter 5: Bulk-Si FinFETs
Chapter 6: Strain-Engineered FinFETs at NanoScale
Chapter 7: Technology CAD of III-Nitride Based Devices
Chapter 8: Strain-Engineered SiGe Channel TFTs for Flexible Electr

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