3D and Circuit Integration of MEMS 1st Edition by Masayoshi Esashi ISBN 3527346473 978-3527346479

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ISBN 10: 3527346473
ISBN 13:  978-3527346479
Author: Masayoshi Esashi

3D and Circuit Integration of MEMS

Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems

MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration.

You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks.

Readers will also benefit from the inclusion of:

• A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices
• An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si
• Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe
• A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters

Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.

3D and Circuit Integration of MEMS 1st Table of contents:

1. Introduction

   • 1.1 Overview of MEMS Technology
   • 1.2 Importance of 3D Integration
   • 1.3 Integration with Electronic Circuits
   • 1.4 Challenges and Opportunities

2. Fundamentals of MEMS

   • 2.1 MEMS Components and Devices
   • 2.2 Microfabrication Techniques
   • 2.3 Materials Used in MEMS
   • 2.4 Sensors and Actuators in MEMS

3. 3D MEMS Integration

   • 3.1 Introduction to 3D MEMS
   • 3.2 3D Integration Architectures
   • 3.3 Advantages of 3D Integration
   • 3.4 Manufacturing Techniques for 3D MEMS
   • 3.5 Case Studies of 3D MEMS Applications

4. Circuit Integration with MEMS

   • 4.1 MEMS and Circuit Co-Design
   • 4.2 Electrical Interfaces for MEMS
   • 4.3 Power Management for MEMS-Circuit Integration
   • 4.4 Signal Processing in MEMS-Circuit Systems
   • 4.5 Packaging and Interconnection Techniques

5. Advanced Technologies in 3D and MEMS Integration

   • 5.1 System-on-Chip (SoC) Integration
   • 5.2 3D IC and MEMS Integration
   • 5.3 MEMS and Photonic Integration
   • 5.4 Integration with Emerging Technologies (AI, IoT, etc.)

6. Design and Simulation Tools for MEMS and Circuit Integration

   • 6.1 Simulation of MEMS Devices
   • 6.2 Circuit Simulation for MEMS Systems
   • 6.3 Multi-Physics Simulation Approaches
   • 6.4 Design Methodologies for MEMS-Circuit Systems

7. Applications of 3D and Circuit-Integrated MEMS

   • 7.1 Consumer Electronics
   • 7.2 Automotive Applications
   • 7.3 Biomedical and Healthcare Systems
   • 7.4 Aerospace and Defense
   • 7.5 Industrial Automation and Robotics

8. Challenges in 3D MEMS and Circuit Integration

   • 8.1 Mechanical-Circuit Co-Design Challenges
   • 8.2 Thermal Management
   • 8.3 Yield and Reliability Issues
   • 8.4 Scaling Challenges

9. Future Trends and Innovations

   • 9.1 Emerging Materials and Processes
   • 9.2 Future Applications and Markets
   • 9.3 The Role of AI and Machine Learning in MEMS Integration
   • 9.4 Vision for Next-Generation MEMS Systems

10. Conclusion

• 10.1 Summary of Key Points
• 10.2 Future Directions in 3D MEMS and Circuit Integration

11. References

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Masayoshi Esashi,Circuit Integration,MEMS