Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments 1st Edition Juan Cepeda-Rizo

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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments 1st Edition Juan Cepeda-Rizo Digital Instant Download

Author(s): Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich
ISBN(s): 9781032160818, 1032160810
Edition: 1
File Details: PDF, 8.26 MB
Year: 2021
Language: English
SKU: EB-36379942 Category: Tags: , ,