Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments 1st Edition by Juan Cepeda Rizo, Jeremiah Gayle, Joshua Ravich ISBN 9781032160818 1032160810

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ISBN 10: 1032160810
ISBN 13: 9781032160818
Author: Juan Cepeda Rizo, Jeremiah Gayle, Joshua Ravich

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments 1st Edition Table of contents:

Chapter 1 Introduction

Electronics in Space

The Importance of the Electronic Packaging Engineer

Baked-in Reliability

Chapter 2 New Space

Focus on Reliability

Focus on Repeatability

Focus on ROI (Return on Investment)

Chapter 3 Thermal/Structural Challenges in Miniaturizing

An Assessment of SpaceVNX by JPL Electronics Packaging Group

Chapter 4 Fundamentals of Heat Transfer by Conduction and Convection

Introduction

Conduction Heat Transfer

Convective Heat Transfer

Chapter 5 Fundamentals of Heat Transfer by Radiation

Introduction

Blackbody Radiation

Emissivity

Absorptivity

Reflectivity

Gray Surfaces

Diffuse Surfaces

Radiation Geometry

Chapter 6 The Multilayer Insulation (MLI) Blanket

Blanket Applications

Design (Driven by Requirements and Considerations)

Chapter 7 Heat Pipes

Variable Conductance Heat Pipes (VCHPs)

Cryogenic Switching Heat Pipes (CSHPs)

Water Sintered-Copper Heat Pipes

Nano Heat Pipes (NHPs)

Testing

I. Introduction

II. Analysis of Heat Pipe Failure

B. Wick Failure

C. 1D Heat Transfer Models

Testing

Freeze/Thaw Test Results

Conclusion

Future Work

Acknowledgement

Phase Change γ-Alumina Aqueous-Based Nanofluid for Improving Heat Pipe Transient Efficiency (The Nano Heat Pipe)

Summary and Conclusions

Chapter 8 Convective Cooling of Semiconductors Using a Nanofluid

Introduction

Forced Convection Flow

Nanofluids for Cooling Electronics

Nanoscale Thermal Interface

Test Vehicle Design

Experimental Setup

Summary and Conclusions

Acknowledgement

Chapter 9 Power Systems: The Tesla Turbine

Introduction

Arriving at a Closed-Form Solution

Case Study, an Automotive Air Conditioner

Chapter 10 Electronics Design for Extreme Temperature and Pressure

Chapter 11 Characterization and Modeling of PWB Warpage and Its Effect on LGA Separable Interconnects

Introduction

Method of Investigation

Results

Conclusion

Acknowledgements

Chapter 12 Resistor Networks

Conduction

Chapter 13 Thermal Analysis Case Studies

Introduction to the Case Studies

Subject: Thermal Analysis of Scanner Demodulator Electronics (SDE) for SHERLOC

Subject: SHERLOC Laser Power Supply Transient Thermal Analysis

Detailed Mode (100 Spectra)

U1—Thermal Strap Thermal Analysis at 55 °C Boundary Temperature

Subject: Universal System Transponder (UST) Thermal Analysis

Subject: Preliminary Power Switch Slice (PSS) Assembly Thermal Analysis

Chapter 14 Random Vibration Structural Analysis and Miles’ Equation

Introduction

Limiting Factors

Load

Modal Response

Relative Displacement

Model

Acceleration Response

Relative Displacement and Spring Force

RMS and Standard Deviation

Chapter 15 Vibrational Analysis Case Studies

Introduction to the Vibrational Case Studies

Subject: Photodiode Board Assembly Structural Analysis

Subject: Sine Vibration Analysis of HRMR DDU for Sentinel-6

Subject: Laser Power Supply (LPS) Structural Analysis

Chapter 16 Creep Prediction of a Printed Wiring Board for Separable Land Grid Array Connector

Introduction

Mechanical Scheme

Prediction of Long-Term Creep

Experimental Setup

Results

Summary and Conclusion

Chapter 17 Operational Case Studies—Mars Surface Operations

MSL Rear Hazcam Thermal Characterization

I. Introduction

II. Description

1. Engineering Cameras

2. Rear Hazcam Environment

3. Model Description

III. Testing of the Rear Hazcam on Mars

Hazcam Thermal Characterization and the ECAM Calculator

IV. Results

A. Hazcam Telemetry vs. ECAM Calculator

B. Model Prediction vs. Telemetry

V. Conclusion

VI. Future Work

VII. Acknowledgement

Laser Power Supply Thermo-Structural Analysis for the Mars 2020 Rover

Introduction

Design Consideration: Thermal and Electrical Isolation

Materials

Thermal Results

Transient Thermal Analysis

Steinberg Fatigue Analysis

Chassis Fasteners

Venting Analysis

Conclusion

Acknowledgement

Chapter 18 Operational Case Studies—Dawn Asteroid Mission

Introduction

Thermal Design Based on Flight Proven Thermal Control Techniques

Operation

Chapter 19 Standards

1.0 Structural Design and Test Requirements (NASA-STD-5001) [1]

2.0 Derating Standards ECSS-Q-ST-30–11-REV1 Derating EEE Components, Page 40 [2]

3.0 GEVS NASA-STD-7000A[3]

4.0 SMC-160 [4]

5.0 Bolt Thermal Resistances—Spacecraft Thermal Control Handbook [5]

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Tags: Juan Cepeda Rizo, Jeremiah Gayle, Joshua Ravich, Structural Electronic, Extreme Environments